This section describes the differences in functionality between product revisions of the CoreLink SIE-200 System IP for Embedded:
Second release. Functional improvement to AMBA® AHB5 downsizer.
Third release. Added the following:
AHB5 example slave.
AHB5 timeout monitor.
AHB5 to external SRAM interface.
AHB5 to ROM interface.
Cortex-M3/Cortex-M4 AHB5 adapter.
Behavioral SRAM model with an AHB5 interface.
External asynchronous 8-bit SRAM model.
External asynchronous 16-bit SRAM model.
FPGA SRAM synthesizable model.
RAM wrapper model.
ROM behavioral model.
ROM wrapper model.
Fourth release. Added the following:
ABHB5 to AHB5 low-latency sync-down bridge.
AHB5 to AHB5 low-latency sync-up bridge.
ABH5 to APB4 low-latency sync-down bridge.
The low-latency bridges in release r3p0 are similar in function to their non-low-latency equivalents. They are options for designs that do not require Q-channel support for power management.
This option enables optimization for reduced latency in these three bridges.