CoreLink DMC-520

The Arm CoreLink DMC-520 Dynamic Memory Controller

Getting Started

The CoreLink DMC-520 Dynamic Memory Controller provides highest bandwidth with low latency access to DDR4 and DDR3 memory in server, networking, and high-performance computing applications. The DMC-520 provides for full DIMM support along with RAS (Reliability, Availability, and Serviceability) and advanced error correction features that are necessary for these infrastructure applications.

  • Delivers best performance with ECC and RAS for data transfers from SoC to high-density memory.
  • Best combination of features, power, cost, and performance.
  • Fast, single-port CHI.A interface for transferring data to DDR4 and DDR3 DRAM memories.

Diagram on enterprise for CCN502 to 512.

Specifications

Features Details
AMBA interface CHI
System interface 1 
System data width 128 bit
Configuration APB interface
Memory interfaces Single DFI 3.1 memory interface with configurable 1:1, 1:2, or 1:4 DFI frequency ratio
Memory types DDR3, DDR3(L),and DDR4
Memory width x40/x72 bit DRAM (includes 8 bits of ECC)
ECC SECDED or enhanced symbol-based ECC
QoS QoS based scheduling algorithm, non-blocking paths to DRAM through CCN
Low power All DRAM power modes are supported and hierarchical clock gating throughout the DMC

DMC-520 Block Diagram.

CoreLink DMC-520 key features

System Optimized DMC with support for single 128-bit wide AMBA 5 CHI system interface

  • Integrated TrustZone address space control functionality in system interface to provide secure memory access.

Support for advanced ECC, RAS,and DIMM capabilities
  • Includes both standard SECDED ECC and advanced symbol-based ECC for correcting failure of X4 chip.
  • DDR3, DDR3L, and DDR4 memories (up to DDR4-3200 speeds) with UDIMM, RDIMM, LRDIMM, and 3DS support.

Quality-of-Service (QoS)

  • QoS improvements over previous generation reducing average and maximum CPU latency.
  • End-to-end QoS optimized with CCN interconnect and Arm v8.x CPUs.

Industry-standard DFI 3.1 Interface

  • Proven interoperability with third-party DFI 3.1 compatible DDR PHYs.

CoreLink DMC-520 Characteristics

CoreLink DMC-520 supports DDR4 which is the most advanced infrastructure-class memory technology available today. DDR4 provides the highest bandwidth (up to 25GB/s per channel for DDR4-3200 Mbps) which supporting reliability and low power features necessary for high-end systems deployment. System-wide QoS for DMC-520 designed and tested with CoreLink CCN Family, Cortex A53, and Cortex A72 processors.

  • TRM

  • CoreLink DMC-520 Technical Reference Manual

    For system designers, system integrators and programmers who are designing a SoC, the Technical Reference Manual is the go-to resource.

    DMC-520 TRM
  • A guide on software optimization.

  • AMBA 5 CHI Specification

    CoreLink DMC-520 is built on AMBA CHI specification, which is Arm's advanced coherent interconnect for high data transfer bandwidths at GHz and above frequencies.

    AMBA specs

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Answered Forum FAQs
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Suggested answer How to calculate AXI interleave depth and reorder depth.
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Answered Forum FAQs Started 8 months ago by Annie 0 replies 5193 views
Answered Forum FAQs Started 8 months ago by Annie 0 replies 4549 views
Suggested answer How to calculate AXI interleave depth and reorder depth. Latest 2 days ago by Koalassy 3 replies 3714 views
Answered One master to two slave transfer (back to back) behavior for address A (slave1) and address B (slave2) Latest 2 days ago by Tapas 2 replies 166 views
Suggested answer Error with Keil RTX5 tutorial Latest 4 days ago by Kevin B 8 replies 1057 views
Answered Is __CC_ARM not defined in the MDK Eval Version? Latest 4 days ago by Grant B 12 replies 722 views