Register to Download our ARM TechCon 2013 whitepaper: Getting the Most Out of the ARM CoreLink NIC-400


This paper was jointly written by William Orme from ARM and Bill Neifert from Carbon Design Systems for ARM TechCon 2013.  It discusses the new features of the ARM CoreLink NIC-400 and how to leverage methodologies and solutions from Carbon Design Systems to optimize this important IP with 100% accuracy.  It has an accompanying presentation available here.

We will process your information entered here in accordance with our Privacy Policy. Please visit our subscription center if you would like to manage your marketing preferences.